System and method of determining one or more inconsistencies in operating information handling systems

ABSTRACT

In one or more embodiments, one or more systems, methods, and/or processes may obtain first multiple samples of a signal conveyed via a coupling of a memory medium of an information handling system; may convert the first multiple samples to respective first multiple digital values; may determine an impedance based at least on the first multiple digital values; may compare the impedance with a baseline impedance; may determine an inconsistency based at least on comparing the impedance with the baseline impedance of the coupling of the memory medium; and may, in response to determining the inconsistency, shut down the information handling system.

BACKGROUND Field of the Disclosure

This disclosure relates generally to information handling systems andmore particularly to determining one or more inconsistencies inoperating information handling systems.

Description of the Related Art

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

SUMMARY

In one or more embodiments, one or more systems, methods, and/orprocesses may obtain first multiple samples of a signal conveyed via acoupling of a memory medium of an information handling system; mayconvert the first multiple samples to respective first multiple digitalvalues; may determine an impedance based at least on the first multipledigital values; may compare the impedance with a baseline impedance ofthe coupling of the memory medium; may determine an inconsistency basedat least on comparing the impedance with the baseline impedance; andmay, in response to determining the inconsistency, shut down theinformation handling system. In one or more embodiments, the firstmultiple samples may include multiple voltage samples. In one or moreembodiments, the first multiple samples may include multiple currentsamples. In one or more embodiments, the one or more systems, methods,and/or processes may further establish the baseline impedance of thecoupling of the memory medium. For example, establishing the baselineimpedance of the coupling may include obtaining second multiple samplesof a second signal conveyed via the coupling, converting the secondmultiple samples to respective second multiple digital values, anddetermining the baseline impedance based at least on the second multipledigital values. For instance, the second multiple digital values may beobtained before the first multiple digital values. In one or moreembodiments, the impedance of the coupling of the memory medium mayinclude a first reactive impedance, and the baseline impedance of thecoupling of the memory medium may include a second reactive impedance.For example, determining the inconsistency may include determining thatthe first reactive impedance does not match the second reactiveimpedance. In one or more embodiments, the one or more systems, methods,and/or processes may further, in response to determining theinconsistency, ground the coupling of the memory medium.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and itsfeatures/advantages, reference is now made to the following description,taken in conjunction with the accompanying drawings, which are not drawnto scale, and in which:

FIG. 1 illustrates an example of an information handling system,according to one or more embodiments;

FIG. 2 illustrates an example embedded controller, according to one ormore embodiments;

FIG. 3A illustrates a first example of a probe coupled to couplings of acomponent of an information handling system, according to one or moreembodiments;

FIG. 3B illustrates a second example of a probe coupled to couplings ofa component of an information handling system, according to one or moreembodiments;

FIG. 4A illustrates a third example of a probe coupled to couplings of acomponent of an information handling system, according to one or moreembodiments;

FIG. 4B illustrates a fourth example of a probe coupled to couplings ofa component of an information handling system, according to one or moreembodiments;

FIG. 5A illustrates a fifth example of a probe coupled to couplings of acomponent of an information handling system, according to one or moreembodiments;

FIG. 5B illustrates another example of a probe coupled to couplings of acomponent of an information handling system, according to one or moreembodiments;

FIG. 6 illustrates an example method of operating an informationhandling system is illustrated, according to one or more embodiments;

FIG. 7 illustrates a second example of a method of operating aninformation handling system, according to one or more embodiments;

FIG. 8 illustrates a third example of a method of operating aninformation handling system, according to one or more embodiments; and

FIG. 9 illustrates another example of a method of operating aninformation handling system is illustrated, according to one or moreembodiments.

DETAILED DESCRIPTION

In the following description, details are set forth by way of example tofacilitate discussion of the disclosed subject matter. It should beapparent to a person of ordinary skill in the field, however, that thedisclosed embodiments are examples and not exhaustive of all possibleembodiments.

As used herein, a reference numeral refers to a class or type of entity,and any letter following such reference numeral refers to a specificinstance of a particular entity of that class or type. Thus, forexample, a hypothetical entity referenced by ‘12A’ may refer to aparticular instance of a particular class/type, and the reference ‘12’may refer to a collection of instances belonging to that particularclass/type or any one instance of that class/type in general.

In one or more embodiments, an information handling system may bedesigned and/or configured to protect the information handling systemthe system and/or one or more of its users from one or more people thatmay have direct physical access to the information handling system. Forexample, the information handling system may be designed and/orconfigured to protect information handling system firmware and/or otherdata stored by the information handling system. For instance, theinformation handling system may rely on non-volatile storage (e.g.,flash memory, non-volatile random access memory, etc.) to storeinformation (e.g., information handling system firmware, sensitiveinformation such as one or more passwords, one or more encryption keys,one or more secure boot certificates, one or more roots of trust, etc.).

In one or more embodiments, the information handling system may bedesigned and/or configured to protect the non-volatile storage fromattacks from one or more networks. In one or more embodiments, theinformation handling system may be designed and/or configured to protectthe non-volatile storage from attacks from direct physical access to oneor more components of the information handling system. For example, theinformation handling system may be designed and/or configured to protectthe non-volatile storage from attacks from direct physical access topins and/or couplings of the non-volatile storage.

As one example, a user of the information handling system may leave theinformation handling system in a hotel room of a hotel, and one or morepersonnel of the hotel may have physical access to the informationhandling system and/or one or more components of the informationhandling system while the user is away from the hotel room. As anotherexample, a user of the information handling system may provide theinformation handling system to a customs officer upon entering acountry. For instance, the information handling system may not bevisible for a period of time while one or more customs officers inspectthe information handling system. In these examples, the informationhandling system may protect the non-volatile storage from a personhaving direct access to pins and/or couplings of the non-volatilestorage. For instance, the information handling system may protect thenon-volatile storage from a person that may attempt to extract one ormore trade secrets, to extract sensitive information, and/or to modifythe information handling system firmware. In these examples, if theinformation handling system did not protect the non-volatile storagefrom a person having direct access to pins and/or couplings of thenon-volatile storage, the person may extract and/or modify informationstored via the non-volatile storage without evidence of tampering withthe non-volatile storage and/or the information handling system.

In one or more embodiments, one or more pins and/or coupling of thenon-volatile storage may be grounded. In one example, one or more pinsand/or coupling of the non-volatile storage may be grounded while theinformation handling system is powered off. In a second example, one ormore pins and/or coupling of the non-volatile storage may be groundedwhile the information handling system is in a low power state. Inanother example, one or more pins and/or coupling of the non-volatilestorage may be grounded while the information handling system is alocked state. For instance, the locked state may include a screen lockof an operating system. In one or more embodiments, grounding one ormore pins and/or coupling of the non-volatile storage may includeengaging one or more switches. For example, the one or more switches maybe coupled to a ground. In one or more embodiments, a switch may be orinclude one or more transistors. In one example, a transistor mayinclude a bipolar junction transistor (BJT), a junction gatefield-effect transistor (JFET), or a metal-oxide-semiconductorfield-effect transistor (MOSFET), among others. In a second example, aswitch may be or include a logic gate. In a third example, a switch maybe or include a mechanical switch. In another example, a switch may beor include a multiplexed (MUXed) switch. For instance, a multiplexer(MUX) may pull one or more of the pins and/or coupling of thenon-volatile storage to ground.

In one or more embodiments, a component of the information handlingsystem may monitor and/or control power rails of the informationhandling system. For example, the component that may monitor and/orcontrol power rails of the information handling system may be or includean embedded controller of the information handling system. In oneinstance, the embedded controller may monitor one or more impedances(e.g., one or more real impedances and/or one or more reactiveimpedances). In a second instance, the embedded controller may monitorone or more pins and/or couplings of the non-volatile storage (e.g., achip select pin and/or coupling, a data pin and/or coupling, a clock pinand/or coupling, a power pin and/or coupling, etc.). In anotherinstance, the embedded controller may electrically control thenon-volatile storage via grounding one or more of the pins and/orcouplings of the non-volatile storage to ground.

Turning now to FIG. 1, an example of an information handling system isillustrated, according to one or more embodiments. An informationhandling system (IHS) 110 may include a hardware resource or anaggregate of hardware resources operable to compute, classify, process,transmit, receive, retrieve, originate, switch, store, display,manifest, detect, record, reproduce, handle, and/or utilize variousforms of information, intelligence, or data for business, scientific,control, entertainment, or other purposes, according to one or moreembodiments. For example, IHS 110 may be a personal computer, a desktopcomputer system, a laptop computer system, a server computer system, amobile device, a tablet computing device, a personal digital assistant(PDA), a consumer electronic device, an electronic music player, anelectronic camera, an electronic video player, a wireless access point,a network storage device, or another suitable device and may vary insize, shape, performance, functionality, and price. In one or moreembodiments, a portable IHS 110 may include or have a form factor ofthat of or similar to one or more of a laptop, a notebook, a telephone,a tablet, and a PDA, among others. For example, a portable IHS 110 maybe readily carried and/or transported by a user (e.g., a person). In oneor more embodiments, components of IHS 110 may include one or morestorage devices, one or more communications ports for communicating withexternal devices as well as various input and output (I/O) devices, suchas a keyboard, a mouse, and a video display, among others. In one ormore embodiments, IHS 110 may include one or more buses operable totransmit communication between or among two or more hardware components.In one example, a bus of IHS 110 may include one or more of a memorybus, a peripheral bus, and a local bus, among others. In anotherexample, a bus of IHS 110 may include one or more of a Micro ChannelArchitecture (MCA) bus, an Industry Standard Architecture (ISA) bus, anEnhanced ISA (EISA) bus, a Peripheral Component Interconnect (PCI) bus,HyperTransport (HT) bus, an inter-integrated circuit (I²C) bus, a serialperipheral interface (SPI) bus, a low pin count (LPC) bus, an enhancedserial peripheral interface (eSPI) bus, a universal serial bus (USB), asystem management bus (SMBus), and a Video Electronics StandardsAssociation (VESA) local bus, among others.

In one or more embodiments, IHS 110 may include firmware that controlsand/or communicates with one or more hard drives, network circuitry, oneor more memory devices, one or more I/O devices, and/or one or moreother peripheral devices. For example, firmware may include softwareembedded in an IHS component utilized to perform tasks. In one or moreembodiments, firmware may be stored in non-volatile memory, such asstorage that does not lose stored data upon loss of power. In oneexample, firmware associated with an IHS component may be stored innon-volatile memory that is accessible to one or more IHS components. Inanother example, firmware associated with an IHS component may be storedin non-volatile memory that may be dedicated to and includes part ofthat component. For instance, an embedded controller may includefirmware that may be stored via non-volatile memory that may bededicated to and includes part of the embedded controller.

As shown, IHS 110 may include a processor 120, a volatile memory medium150, non-volatile memory media 160 and 170, an I/O subsystem 175, anetwork interface 180, sensors 182-184, and an embedded controller (EC)190. As illustrated, volatile memory medium 150, non-volatile memorymedia 160 and 170, I/O subsystem 175, network interface 180, and EC 190may be communicatively coupled to processor 120. As shown, sensors182-184 may be coupled to EC 190. In one or more embodiments, one ormore of sensors 182-184 may include one or more of a Hall effect sensor,an electronic magnetometer, a motion sensor, a proximity sensor, anelectronic accelerometer, an electronic gyroscope, a camera, and ananalog to digital converter, among other sensors. In one or moreembodiments, EC 190 and/or one or more of sensors 182-184 may be coupledto one or more other components of IHS 110 and/or may be coupled to onemore coupling of one or more other components of IHS 110.

In one or more embodiments, one or more of volatile memory medium 150,non-volatile memory media 160 and 170, I/O subsystem 175, and networkinterface 180 may be communicatively coupled to processor 120 via one ormore buses, one or more switches, and/or one or more root complexes,among others. In one example, one or more of volatile memory medium 150,non-volatile memory media 160 and 170, I/O subsystem 175, and networkinterface 180 may be communicatively coupled to processor 120 via one ormore PCI-Express (PCIe) root complexes. In another example, one or moreof an I/O subsystem 175 and a network interface 180 may becommunicatively coupled to processor 120 via one or more PCIe switches.

In one or more embodiments, the term “memory medium” may mean a “storagedevice”, a “memory”, a “memory device”, a “tangible computer readablestorage medium”, and/or a “computer-readable medium”. For example,computer-readable media may include, without limitation, storage mediasuch as a direct access storage device (e.g., a hard disk drive, afloppy disk, etc.), a sequential access storage device (e.g., a tapedisk drive), a compact disk (CD), a CD-ROM, a digital versatile disc(DVD), a random access memory (RAM), a read-only memory (ROM), aone-time programmable (OTP) memory, an electrically erasableprogrammable read-only memory (EEPROM), and/or a flash memory, a solidstate drive (SSD), or any combination of the foregoing, among others.

In one or more embodiments, one or more protocols may be utilized intransferring data to and/or from a memory medium. For example, the oneor more protocols may include one or more of small computer systeminterface (SCSI), Serial Attached SCSI (SAS) or another transport thatoperates with the SCSI protocol, advanced technology attachment (ATA),serial ATA (SATA), a USB interface, an Institute of Electrical andElectronics Engineers (IEEE) 1394 interface, a Thunderbolt interface, anadvanced technology attachment packet interface (ATAPI), serial storagearchitecture (SSA), integrated drive electronics (IDE), or anycombination thereof, among others.

Volatile memory medium 150 may include volatile storage such as, forexample, RAM, DRAM (dynamic RAM), EDO RAM (extended data out RAM), SRAM(static RAM), etc. One or more of non-volatile memory media 160 and 170may include nonvolatile storage such as, for example, a read only memory(ROM), a programmable ROM (PROM), an erasable PROM (EPROM), anelectrically erasable PROM, NVRAM (non-volatile RAM), ferroelectric RAM(FRAM), a magnetic medium (e.g., a hard drive, a floppy disk, a magnetictape, etc.), optical storage (e.g., a CD, a DVD, a BLU-RAY disc, etc.),flash memory, a SSD, etc. In one or more embodiments, a memory mediumcan include one or more volatile storages and/or one or more nonvolatilestorages.

In one or more embodiments, network interface 180 may be utilized incommunicating with one or more networks and/or one or more otherinformation handling systems. In one example, network interface 180 mayenable IHS 110 to communicate via a network utilizing a suitabletransmission protocol and/or standard. In a second example, networkinterface 180 may be coupled to a wired network. In a third example,network interface 180 may be coupled to an optical network. In anotherexample, network interface 180 may be coupled to a wireless network.

In one or more embodiments, network interface 180 may be communicativelycoupled via a network to a network storage resource. For example, thenetwork may be implemented as, or may be a part of, a storage areanetwork (SAN), personal area network (PAN), local area network (LAN), ametropolitan area network (MAN), a wide area network (WAN), a wirelesslocal area network (WLAN), a virtual private network (VPN), an intranet,an Internet or another appropriate architecture or system thatfacilitates the communication of signals, data and/or messages(generally referred to as data). For instance, the network may transmitdata utilizing a desired storage and/or communication protocol,including one or more of Fibre Channel, Frame Relay, AsynchronousTransfer Mode (ATM), Internet protocol (IP), other packet-basedprotocol, Internet SCSI (iSCSI), or any combination thereof, amongothers.

In one or more embodiments, processor 120 may execute processorinstructions in implementing one or more systems, flowcharts, methods,and/or processes described herein. In one example, processor 120 mayexecute processor instructions from one or more of memory media 150-170in implementing one or more systems, flowcharts, methods, and/orprocesses described herein. In another example, processor 120 mayexecute processor instructions via network interface 180 in implementingone or more systems, flowcharts, methods, and/or processes describedherein.

In one or more embodiments, processor 120 may include one or more of asystem, a device, and an apparatus operable to interpret and/or executeprogram instructions and/or process data, among others, and may includeone or more of a microprocessor, a microcontroller, a digital signalprocessor (DSP), an application specific integrated circuit (ASIC), andanother digital or analog circuitry configured to interpret and/orexecute program instructions and/or process data, among others. In oneexample, processor 120 may interpret and/or execute program instructionsand/or process data stored locally (e.g., via memory media 150-170and/or another component of IHS 110). In another example, processor 120may interpret and/or execute program instructions and/or process datastored remotely (e.g., via a network storage resource).

In one or more embodiments, I/O subsystem 175 may represent a variety ofcommunication interfaces, graphics interfaces, video interfaces, userinput interfaces, and/or peripheral interfaces, among others. Forexample, I/O subsystem 175 may include one or more of a touch panel anda display adapter, among others. For instance, a touch panel may includecircuitry that enables touch functionality in conjunction with a displaythat is driven by a display adapter.

As shown, non-volatile memory medium 160 may include an operating system(OS) 162, and applications (APPs) 164-168. In one or more embodiments,one or more of OS 162 and APPs 164-168 may include processorinstructions executable by processor 120. In one example, processor 120may execute processor instructions of one or more of OS 162 and APPs164-168 via non-volatile memory medium 160. In another example, one ormore portions of the processor instructions of the one or more of OS 162and APPs 164-168 may be transferred to volatile memory medium 150, andprocessor 120 may execute the one or more portions of the processorinstructions of the one or more of OS 162 and APPs 164-168 via volatilememory medium 150.

As illustrated, non-volatile memory medium 170 may include informationhandling system firmware (IHSFW) 172. In one or more embodiments, IHSFW172 may include processor instructions executable by processor 120. Forexample, IHSFW 172 may include one or more structures and/orfunctionalities of one or more of a basic input/output system (BIOS), anExtensible Firmware Interface (EFI), a Unified Extensible FirmwareInterface (UEFI), and an Advanced Configuration and Power Interface(ACPI), among others. In one instance, processor 120 may executeprocessor instructions of IHSFW 172 via non-volatile memory medium 170.In another instance, one or more portions of the processor instructionsof IHSFW 172 may be transferred to volatile memory medium 150, andprocessor 120 may execute the one or more portions of the processorinstructions of IHSFW 172 via volatile memory medium 150.

In one or more embodiments, EC 190 may be or include a microcontroller.For example, the microcontroller may be or include an 8051microcontroller, an ARM Cortex-M (e.g., Cortex-MO, Cortex-MO+,Cortex-M1, Cortex-M3, Cortex-M4, Cortex-M7, etc.) microcontroller, aMSP430 microcontroller, an AVR (e.g., 8-bit AVR, AVR-32, etc.)microcontroller, a PIC microcontroller, a 68HC11 microcontroller, aColdFire microcontroller, and a Renesas microcontroller, among others.In one or more embodiments, EC 190 may be or include one or more of afield programmable gate array (FPGA) and an application specificintegrated circuit (ASIC), among others, configured, coded, and/orencoded with instructions in accordance with one or more of systems,flowcharts, methods, and/or processes described herein.

In one or more embodiments, processor 120 and one or more components ofIHS 110 may be included in a system-on-chip (SoC). For example, the SoCmay include processor 120 and a platform controller hub (notspecifically illustrated).

Turning now to FIG. 2, an example embedded controller is illustrated,according to one or more embodiments. As shown, EC 190 may include aprocessor 220, a volatile memory medium 250, a non-volatile memorymedium 270, and an interface 280. As illustrated, non-volatile memorymedium 274 may include an EC FW 274, which may include an OS 262 andAPPs 264-268, and may include EC data 277. For example, OS 262 may be orinclude a real-time operating system (RTOS).

In one or more embodiments, interface 280 may include circuitry thatenables communicatively coupling to one or more devices. In one example,interface 280 may include circuitry that enables communicativelycoupling to one or more buses. In a second example, interface 280 mayinclude circuitry that enables one or more interrupt signals to bereceived. In one instance, interface 280 may include general purposeinput/output (GPIO) circuitry, and the GPIO circuitry may enable one ormore interrupt signals to be received and/or provided via at least oneinterrupt line. In another instance, interface 280 may include GPIOcircuitry that may enable EC 190 to provide and/or receive signalsassociated with other circuitry (e.g., diagnostic circuitry, etc.). In athird example, interface 280 may include circuitry that enablescommunicatively coupling to one or more networks. In one instance,interface 280 may include circuitry that enables communicativelycoupling to network interface 180. In another example, interface 280 mayinclude a network interface.

In one or more embodiments, one or more of OS 262 and APPs 264-268 mayinclude processor instructions executable by processor 220. In oneexample, processor 220 may execute processor instructions of one or moreof OS 262 and APPs 264-268 via non-volatile memory medium 270. Inanother example, one or more portions of the processor instructions ofthe one or more of OS 262 and APPs 264-268 may be transferred tovolatile memory medium 250, and processor 220 may execute the one ormore portions of the processor instructions of the one or more of OS 262and APPs 264-268 via volatile memory medium 250. In one or moreembodiments, processor 220 may execute instructions in accordance withone or more of systems, flowcharts, methods, and/or processes describedherein. For example, non-volatile memory medium 270 and/or volatilememory medium 260 may store instructions that may be executable inaccordance with one or more of systems, flowcharts, methods, and/orprocesses described herein. In one or more embodiments, processor 220may utilize EC data 277. In one example, processor 220 may utilize ECdata 277 via non-volatile memory medium 270. In another example, one ormore portions of EC data 277 may be transferred to volatile memorymedium 250, and processor 220 may utilize EC data 277 via volatilememory medium 250.

Turning now to FIG. 3A, a first example of a probe coupled to couplingsof a component of an information handling system is illustrated,according to one or more embodiments. As shown, IHS 110 may include aswitch 310. In one or more embodiments, switch 310 may include multipleswitches. As illustrated, couplings 320A-320D may be coupled to switch310. In one or more embodiments, a coupling 320 may be or include aprinted circuit board (PCB) trace. In one or more embodiments, wipers315A-315D may be controlled to switch couplings 320A-320D to couplings330A-330D, respectively, or to ground. For example, couplings 330A-330Dmay be coupled to a component of IHS 110. For instance, couplings330A-330D may be coupled to processor 120. In one or more embodiments,EC 190 may control wipers 315A-315D. As shown, EC 190 may be coupled toswitch 310.

In one or more embodiments, wipers 315A-315D may not be physical wipers.For example, wipers 315A-315D may be for illustrative purposes, to showswitching logic. For instance, wipers 315A-315D may implemented viasemiconductors. In one or more embodiments, a switch of switch 310 maybe or include one or more transistors. In one example, a transistor mayinclude a BJT, a JFET, or a MOSFET, among others. In a second example, aswitch may be or include a logic gate. In a third example, a switch maybe or include a mechanical switch. In another example, a switch may beor include a MUXed switch. In one instance, a MUX may pull one or moreof the pins and/or coupling of a memory medium to ground. In anotherinstance, the MUX may couple the one or more of the pins and/or couplingof the memory medium to another component of IHS 110.

In one or more embodiments, a probe may be coupled to one or morecouplings and/or pins of an information handling system. In one example,the probe may receive signals from the one or more couplings and/or pinsof the information handling system. For instance, the probe may snoopand/or copy signals from the one or more couplings and/or pins of theinformation handling system. In another example, the probe may providesignals to the one or more couplings and/or pins of the informationhandling system. For instance, the probe may provide data to and/orprovide processor instructions to the one or more couplings and/or pinsof the information handling system. In one or more embodiments, a probemay be or include a programmer. In one example, the probe may configureone or more memory media. In one instance, the one or more memory mediamay include one or more non-volatile memory media. In another instance,the memory media may be or include one or more serial memory media. In asecond example, the probe may configure one or more processing devices.In a third example, the probe may read configure information from one ormore memory media. In one instance, the one or more memory media mayinclude one or more non-volatile memory media. In another instance, thememory media may be or include one or more serial memory media. Inanother example, the probe may read configuration information from oneor more processing devices.

As illustrated, probe 340 may be coupled to one or more couplings ofnon-volatile memory medium 170. As illustrated, probe 340 may be coupledto couplings 320A-320C of non-volatile memory medium 170 via couplings350A-350C, respectively. In one or more embodiments, probe 340 may notconfigure non-volatile memory medium 170 when switch 310 grounds one ormore of couplings 320A-320C. In one or more embodiments, probe 340 maynot read information from non-volatile memory medium 170 when switch 310grounds one or more of couplings 320A-320C.

Turning now to FIG. 3B, a second example of a probe coupled to couplingsof a component of an information handling system is illustrated,according to one or more embodiments. As illustrated, couplings320A-320D may be coupled to EC 190. In one or more embodiments, EC 190may ground one or more of couplings 320A-320D. In one or moreembodiments, EC 310 may include one or more transistors that may groundone or more of couplings 320A-320D. For example, a transistor mayinclude a BJT, a JFET, or a MOSFET, among others. In one or moreembodiments, EC 190 may include one or more switches that may ground oneor more of couplings 320A-320D. In one or more embodiments, a switch ofEC 190 may be or include one or more transistors. In one example, atransistor may include a BJT, a JFET, or a MOSFET, among others. In asecond example, a switch may be or include a logic gate. In a thirdexample, a switch may be or include a mechanical switch. In anotherexample, a switch may be or include a MUXed switch. In one instance, aMUX may pull one or more of the pins and/or coupling of a memory mediumto ground. In another instance, the MUX may couple the one or more ofthe pins and/or coupling of the memory medium to another component ofIHS 110. In one or more embodiments, EC 190 may include one or morestructures and/or one or more functionalities as those described withreference to switch 310.

Turning now to FIG. 4A, a third example of a probe coupled to couplingsof a component of an information handling system is illustrated,according to one or more embodiments. As shown, IHS 110 may includeanalog to digital converters (ADCs) 410A-410D. In one or moreembodiments, an analog to digital converter (ADC) may be or include adevice and/or a system that may transform an analog signal to a digitalsignal. For example, an ADC may transform an analog voltage or an analogcurrent to a digital number. In one instance, the digital number mayrepresent a magnitude of the analog voltage or the analog current. Inanother instance, the digital number may represent a direction (e.g.,positive or negative) of the analog voltage or the analog current. Inone or more embodiments, the digital number may or include data thatthat is proportional to the analog voltage or the analog current. Forexample, data that that is proportional to the analog voltage or theanalog current may be or include a number that is proportional to theanalog voltage or the analog current. For instance, the number that isproportional to the analog voltage or the analog current may be orinclude a two's complement binary number that is proportional to theanalog voltage or the analog current.

As illustrated, EC 190 may be coupled to ADCs 410A-410D. For example,ADCs 410A-410D may be coupled to interface 280 of EC 190. In one or moreembodiments, ADCs 410A-410D may provide information to EC 190. Forexample, ADCs 410A-410D may provide, to EC 190, information associatedwith one or more signals associated with one or more of couplings320A-320D, respectively. In one instance, an ADC 410 may provide one ormore digital values to EC 190. In another instance, EC 190 may receivethe one or more digital values from ADC 410. In one or more embodiments,information from an ADC 410 may be utilized in determining an impedancefor a coupling 320. In one example, an impedance for a coupling 320 maybe or include a real impedance. In another example, an impedance for acoupling 320 may be or include a reactive impedance. In one or moreembodiments, an impedance for a coupling 320 may be or include amagnitude and a phase.

In one or more embodiments, if a probe lead 350 is coupled to a coupling320, an impedance of coupling 320 may change. For example, an impedanceof coupling 320 may change from a baseline impedance to anotherimpedance. For instance, a baseline reactance of coupling 320 may changeto another reactance. In one or more embodiments, a probe lead 350coupled to a coupling 320 may increase a capacitance of coupling 320.For example, an impedance of coupling 320 may change from a baselineimpedance to another impedance based at least on capacitance from probelead 350. For instance, a baseline reactance of coupling 320 may changeto another reactance based on an increased capacitance from probe lead350. In one or more embodiments, EC 190 may determine a change inimpedance of a coupling 320. For example, EC 190 may utilize an ADC 410,coupled to coupling 320, to determine a change in impedance of coupling320. For instance, if a probe lead 350 is coupled to coupling 320, probelead 350 may increase a determined and/measured capacitance of coupling320.

Turning now to FIG. 4B, a fourth example of a probe coupled to couplingsof a component of an information handling system is illustrated,according to one or more embodiments. As shown, EC 190 may include ADCs410A-410D.

Turning now to FIG. 5A, a fifth example of a probe coupled to couplingsof a component of an information handling system is illustrated,according to one or more embodiments. As shown, IHS 110 may include achipset 510. For example, chipset 510 may include processor 120. Asillustrated, chipset 510 may be coupled to coupling 320A. In oneexample, chipset 510 may provide a clock signal to coupling 320A. In asecond example, chipset 510 may provide a chip select signal to coupling320A. In a third example, chipset 510 may receive data from coupling320A. In another example, chipset 510 may provide data to coupling 320A.As shown, EC 190 may be coupled to coupling 320A. As illustrated, aresistor 520A may be coupled to coupling 320A. For example, resistor520A may be or include a pull-up resistor. As shown, a resistor 520B maybe coupled to chipset 510. As illustrated, resistor 520B may be coupledto EC 190. For example, resistor 520B may be or include a pull-upresistor.

As illustrated, a diode 530 may be coupled to coupling 320A. As shown,diode 530 may be coupled to chipset 510. As illustrated, EC 190 may becoupled to both sides of diode 530. In one or more embodiments, EC 190may determine a voltage drop across diode 530. For example, EC 190 maymonitor multiple voltage drops across diode 530 by determining multiplevoltage drops across diode 530 at multiple different times. Forinstance, the multiple different times may be or include multipleperiodic times. In one or more embodiments, EC 190 may determine thatprobe coupling 350A is providing a clock signal. For example, EC 190 maydetermine a presence of a clock signal via coupling 320A and maydetermine no presence of a clock signal from chipset 510. In one or moreembodiments, EC 190 may determine that probe coupling 350A is providinga chip select signal. For example, EC 190 may determine a presence of achip select signal via coupling 320A and may determine no presence of achip select signal from chipset 510.

Turning now to FIG. 5B, another example of a probe coupled to couplingsof a component of an information handling system is illustrated,according to one or more embodiments. As shown, chipset 510 may becoupled to EC 190. In one or more embodiments, chipset 510 may provide afirst clock signal to EC 190. For example, EC 190 may provide a secondclock signal to coupling 520A. For instance, the second clock signal maybe based at least on the first clock signal. In one or more embodiments,EC 190 may determine one or more changes of the second clock signal. Forexample, if an impedance of coupling 520A changes, the second clocksignal may change. For instance, probe coupling 350A may change animpedance of coupling 520A, which may cause a change in the second clocksignal. In one or more embodiments, EC 190 may determine that a thirdclock signal is present via coupling 520A. For example, EC 190 maydetermine that probe coupling 350A is providing the third clock signal.If EC 190 determines that the third clock signal is present via coupling520A, EC 190 may ground one or more of couplings 320A-320D, according toone or more embodiments.

In one or more embodiments, chipset 510 may provide a first chip selectchip select signal to EC 190. For example, EC 190 may provide a secondchip select signal to coupling 520A. For instance, the second chipselect signal may be based at least on the first chip select signal. Inone or more embodiments, EC 190 may determine one or more changes of thesecond chip select signal. For example, if an impedance of coupling 520Achanges, the second chip select signal may change. For instance, probecoupling 350A may change an impedance of coupling 520A, which may causea change in the second chip select signal. In one or more embodiments,EC 190 may determine that a third chip select signal is present viacoupling 520A. For example, EC 190 may determine that probe coupling350A is providing the chip select signal. If EC 190 determines that thethird chip select signal is present via coupling 520A, EC 190 may groundone or more of couplings 320A-320D, according to one or moreembodiments.

In one or more embodiments, chipset 510 may provide a first data signalto EC 190. For example, EC 190 may provide a second data signal tocoupling 520A. For instance, the second data signal may be based atleast on the first data signal. In one or more embodiments, EC 190 maydetermine one or more changes of the second data signal. For example, ifan impedance of coupling 520A changes, the second data signal maychange. For instance, probe coupling 350A may change an impedance ofcoupling 520A, which may cause a change in the second data signal. Inone or more embodiments, EC 190 may determine that a third data signalis present via coupling 520A. For example, EC 190 may determine thatprobe coupling 350A is providing the data signal. If EC 190 determinesthat the third data signal is present via coupling 520A, EC 190 mayground one or more of couplings 320A-320D, according to one or moreembodiments.

Turning now to FIG. 6, an example method of operating an informationhandling system is illustrated, according to one or more embodiments. At610, an information handling system may be booted. For example, IHS 110may be booted for a first time. For instance, IHS 110 may be booted fora first time at a manufacturing facility of information handlingsystems.

At 615, one or more baselines may be established. In one or moreembodiments, establishing one or more baselines may include determiningone or more impedances of one or more couplings. For example, one ormore baselines impedances of one or more of couplings 320A-320D, amongothers, may be determined and/or established. For instance, EC 190 maydetermine and/or may establish one or more baselines impedances of oneor more of couplings 320A-320D, among others. In one or moreembodiments, establishing one or more baselines may include learning oneor more impedances of one or more couplings. For example, learning theone or more baselines may include utilizing one or more statisticalmethods and/or one or more statistical processes to establish one ormore impedances of one or more couplings. In one or more embodiments,establishing a baseline impedance may include an analog to digitalconverter obtaining multiple samples of a signal conveyed via a couplingof a memory medium of an information handling system. For example, ADC410 may obtain multiple samples of a signal conveyed via coupling 320.In one instance, the signal conveyed via coupling 320 may be or includea clock signal. In a second instance, the signal conveyed via coupling320 may be or include a data signal.

At 620, the one or more baselines may be stored. For example, EC 190 maystore the one or more baselines via a memory medium. For instance, EC190 may store the one or more baselines via non-volatile memory medium270. In one or more embodiments, EC 190 may configure EC data 277 withand/or configure EC data 277 to include the one or more baselines. Forexample, EC data 277 may store the one or more baselines. At 625, amanufacturing mode may be exited. In one example, IHS 110 may be placedinto a manufacturing mode when IHS 110 first boots. In another example,IHS 110 may be placed into a manufacturing mode before IHS 110 firstboots.

At 630, the information handling system may be shipped. In one example,IHS 110 may be shipped to a warehouse. In a second example, IHS 110 maybe shipped to a commercial vendor of information handling systems. Inanother example, IHS 110 may be shipped to an end user. At 635, theinformation handling system may be booted. For example, IHS 110 may bebooted by an end user.

Turning now to FIG. 7, a second example of a method of operating aninformation handling system is illustrated, according to one or moreembodiments. At 710, an information handling system may be powered up.For example, IHS 110 may be powered up. For instance, EC 190 may powerup IHS 110. At 715, one or more couplings of a memory medium may beungrounded. For example, one or more of couplings 320A-320D may beungrounded. For instance, switch 310 may have grounded one or more ofcouplings 320A-320D, and switch 310 may unground one or more ofcouplings 320A-320D. In one or more embodiments, EC 190 may provide asignal to switch 310 to unground one or more of couplings 320A-320D. Inone or more embodiments, EC 190 may have grounded one or more ofcouplings 320A-320D, and EC 190 may unground one or more of couplings320A-320D.

At 720, power may be applied to voltage rails of the informationhandling system. For example, power may be applied to voltage rails ofIHS 110. For instance, EC 190 may control applying power to the voltagerails of IHS 110. At 725, one or more impedances of one or morecouplings may be determined. For example, one or more impedances of oneor more couplings 320A-320D may be determined. For instance, EC 190 maydetermine one or more impedances of one or more couplings 320A-320D. Inone or more embodiments, EC 190 may utilize one or more ADCs indetermining one or more impedances of one or more couplings 320A-320D.

At 730, it may be determined if the one or more determined impedances ofthe one or more couplings match all respective one or more baselinesimpedances of the one or more couplings. For example, it may bedetermined if the one or more determined impedances of the one or morecouplings 320A-320D match one or more baselines impedances of the one ormore couplings 320A-320D. For instance, EC 190 may determine if the oneor more determined impedances of the one or more couplings 320A-320Dmatch one or more baselines impedances of the one or more couplings320A-320D. In one or more embodiments, determining if the one or moredetermined impedances of the one or more couplings match one or morebaselines impedances of the one or more couplings may includedetermining if the one or more determined impedances of the one or morecouplings match one or more baselines impedances of the one or morecouplings within one or more tolerances and/or within one or moreranges. In one example, it may be determined that the one or moredetermined impedances of the one or more couplings match one or morebaselines impedances of the one or more couplings if the one or moredetermined impedances of the one or more couplings are within one ormore tolerances and/or are within one or more ranges of the one or morebaselines impedances of the one or more couplings. In another example,it may be determined that the one or more determined impedances of theone or more couplings do not match one or more baselines impedances ofthe one or more couplings if the one or more determined impedances ofthe one or more couplings are not within one or more tolerances and/orare not within one or more ranges of the one or more baselinesimpedances of the one or more couplings.

If the one or more determined impedances of the one or more couplingsmatch the one or more baselines impedances of the one or more couplings,an operating system may be booted, at 735. For example, OS 162 may bebooted. If the one or more determined impedances of the one or morecouplings do not match the one or more baselines impedances of the oneor more couplings, information associated with the one or moredetermined impedances of the one or more couplings not matching the oneor more baselines impedances of the one or more couplings may be stored,at 740. For example, EC 190 may store information associated with theone or more determined impedances of the one or more couplings notmatching the one or more baselines impedances of the one or morecouplings. For instance, EC 190 may store the information vianon-volatile memory medium 270. In one or more embodiments, EC 190 mayconfigure EC data 277 to store and/or include the information associatedwith the one or more determined impedances of the one or more couplingsnot matching the one or more baselines impedances of the one or morecouplings. At 745, the information handling system may be powered down.For example, IHS 110 may be powered down. For instance, EC 190 may powerdown IHS 110.

Turning now to FIG. 8, a third example of a method of operating aninformation handling system is illustrated, according to one or moreembodiments. In one or more embodiments, method elements 810-820, 830,and 840 may be performed in accordance with method elements 710-720,735, and 745, respectively, of FIG. 7. At 825, it may be determined ifone or more couplings are being driven externally. For example, probe340 may drive coupling 320A, via coupling 350A. For instance, probe 340may considered external to IHS 110.

If one or more couplings are not being driven externally, the method mayproceed to 830. If one or more couplings are being driven externally,information associated with the one or more couplings being drivenexternally may be stored. For example, EC 190 may store informationassociated with the one or more couplings being driven externally. Forinstance, EC 190 may store the information via non-volatile memorymedium 270. In one or more embodiments, EC 190 may configure EC data 277to store and/or include the information associated with the one or morecouplings being driven externally.

Turning now to FIG. 9, another example of a method of operating aninformation handling system is illustrated, according to one or moreembodiments. At 910, an analog to digital converter may obtain firstmultiple samples of a signal conveyed via a coupling of a memory mediumof an information handling system. For example, an ADC 410 may obtainfirst multiple samples of a signal conveyed via a coupling 320. In oneinstance, the signal conveyed via coupling 320 may include a signal fromchipset 510 or EC 190. In another instance, the signal conveyed viacoupling 320 may include a signal from probe 340. In one or moreembodiments, the signal conveyed via coupling 320 may be a digitalsignal. In one or more embodiments, the signal conveyed via coupling 320may be an analog signal that may include the digital signal. In one ormore embodiments, the signal conveyed via coupling 320 may be an analogsignal that may represent the digital signal. In one or moreembodiments, the first multiple samples of the signal conveyed via thecoupling may include multiple voltage samples. In one or moreembodiments, the first multiple samples of the signal conveyed via thecoupling may include multiple current (e.g., Coulombs per second)samples.

At 915, the analog to digital converter may convert the multiple samplesto respective first multiple digital values. For example, ADC 410 mayconvert the multiple samples to respective first multiple digitalvalues. In one or more embodiments, the first multiple digital valuesmay be or include respective multiple numbers. At 920, an impedancebased at least on the first multiple digital values may be determined.For example, EC 190 may determine an impedance based at least on thefirst multiple digital values. For instance, the first multiple digitalvalues may be or include respective first numbers.

At 925, the impedance may be compared with a baseline impedance of thecoupling of the memory medium. For example, EC 190 may compare theimpedance of coupling 320 with a baseline impedance of coupling 320. Inone or more embodiments, EC 190 may retrieve the baseline impedance ofcoupling 320 from non-volatile memory medium 270. For example, EC 190may retrieve the baseline impedance of coupling 320 from EC data 277. At930, an inconsistency based at least on comparing the impedance with thebaseline impedance of the coupling of the memory medium may bedetermined. For example, EC 190 may determine an inconsistency based atleast on comparing the impedance of coupling 320 with the baselineimpedance of coupling 320. In one or more embodiments, determining theinconsistency may include determining that the impedance does not matchthe baseline impedance. For example, determining the inconsistency mayinclude determining that the impedance does not match the baselineimpedance within a tolerance and/or within a range.

At 935, information associated with the inconsistency may be stored. Forexample, EC 190 may store information associated with the inconsistency.For instance, EC 190 may store the information via non-volatile memorymedium 270. In one or more embodiments, EC 190 may configure EC data 277to store and/or include the information associated with inconsistency.In one or more embodiments, the information associated with theinconsistency may include information associated with a possibleintrusion or associated with an actual intrusion.

At 940, the information handling system may be shut down. For example,EC 190 may shut down IHS 110. In one or more embodiments, theinformation handling system may be shut down in response to determiningthe inconsistency. At 945, the coupling of the memory medium may begrounded. For example, EC 190 may ground the coupling. In one instance,EC 190 control switch 310 to ground coupling 320. In another instance,EC 190 may ground the coupling via one or more semiconductors. In one ormore embodiments, the coupling of the memory medium may be grounded inresponse to determining the inconsistency. In one or more embodiments,grounding the coupling may include grounding other couplings of thememory medium. For example, grounding the other couplings of the memorymedium may be performed in response to determining the inconsistency.

In one or more embodiments, one or more of the method and/or processelements and/or one or more portions of a method and/or processorelements may be performed in varying orders, may be repeated, or may beomitted. Furthermore, additional, supplementary, and/or duplicatedmethod and/or process elements may be implemented, instantiated, and/orperformed as desired, according to one or more embodiments. Moreover,one or more of system elements may be omitted and/or additional systemelements may be added as desired, according to one or more embodiments.In one or more embodiments, identifications of first, second, third,etc. may be utilized as enumerations. For example, the enumerations maynot necessarily imply any ordering.

In one or more embodiments, a memory medium may be and/or may include anarticle of manufacture. For example, the article of manufacture mayinclude and/or may be a software product and/or a program product. Forinstance, the memory medium may be coded and/or encoded withprocessor-executable instructions in accordance with one or moreflowcharts, systems, methods, and/or processes described herein toproduce the article of manufacture.

The above disclosed subject matter is to be considered illustrative, andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments which fall within thetrue spirit and scope of the present disclosure. Thus, to the maximumextent allowed by law, the scope of the present disclosure is to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing detailed description.

What is claimed is:
 1. An information handling system, comprising: amemory medium, coupled to a plurality of couplings; an analog to digitalconverter, coupled to a coupling of the plurality of couplings; and anembedded controller; wherein the analog to digital converter isconfigured to: obtain a first plurality of samples of a first signalconveyed via the coupling of the plurality of couplings; and convert thefirst plurality of samples to a respective first plurality of digitalvalues; and wherein the embedded controller is configured to: determinean impedance based at least on the first plurality of digital values;compare the impedance with a baseline impedance of the coupling of thememory medium; determine an inconsistency based at least on comparingthe impedance with the baseline impedance of the coupling of the memorymedium; and in response to determining the inconsistency, shut down theinformation handling system.
 2. The information handling system of claim1, wherein the impedance of the coupling of the memory medium includes afirst reactive impedance; wherein the baseline impedance of the couplingof the memory medium includes a second reactive impedance; and wherein,to determine the inconsistency, the embedded controller is furtherconfigured to determine that the first reactive impedance does not matchthe second reactive impedance.
 3. The information handling system ofclaim 1, wherein the first plurality of samples includes a plurality ofvoltage samples.
 4. The information handling system of claim 1, whereinthe embedded controller is further configured to establish the baselineimpedance of the coupling of the memory medium.
 5. The informationhandling system of claim 4, wherein the analog to digital converter isfurther configured to: obtain a second plurality of samples of a secondsignal conveyed via the coupling; and convert the second plurality ofsamples to a respective second plurality of digital values; and wherein,to establish the baseline impedance of the coupling of the memorymedium, the embedded controller is further configured to determine thebaseline impedance based at least on the second plurality of digitalvalues.
 6. The information handling system of claim 1, wherein theembedded controller includes the analog to digital converter.
 7. Theinformation handling system of claim 1, wherein the embedded controlleris further configured to: in response to determining the inconsistency,ground the coupling of the memory medium.
 8. A method, comprising: ananalog to digital converter obtaining a first plurality of samples of afirst signal conveyed via a coupling of a memory medium of aninformation handling system; the analog to digital converter convertingthe first plurality of samples to a respective first plurality ofdigital values; determining an impedance based at least on the firstplurality of digital values; comparing the impedance with a baselineimpedance of the coupling of the memory medium; determining aninconsistency based at least on the comparing the impedance with thebaseline impedance of the coupling of the memory medium; and in responseto the determining the inconsistency, shutting down the informationhandling system.
 9. The method of claim 8, wherein the impedance of thecoupling of the memory medium includes a first reactive impedance;wherein the baseline impedance of the coupling of the memory mediumincludes a second reactive impedance; and wherein the determining theinconsistency includes determining that the first reactive impedancedoes not match the second reactive impedance.
 10. The method of claim 8,wherein the first plurality of samples includes a plurality of voltagesamples.
 11. The method of claim 8, further comprising: establishing thebaseline impedance of the coupling of the memory medium.
 12. The methodof claim 11, wherein the establishing the baseline impedance of thecoupling of the memory medium includes: the analog to digital converterobtaining a second plurality of samples of a second signal conveyed viathe coupling; the analog to digital converter converting the secondplurality of samples to a respective second plurality of digital values;and determining the baseline impedance based at least on the secondplurality of digital values.
 13. The method of claim 8, wherein anembedded controller of the information handling system includes theanalog to digital converter.
 14. The method of claim 8, furthercomprising: in response to the determining the inconsistency, groundingthe coupling of the memory medium.
 15. An embedded controller,configured to: receive a first plurality of digital values via an analogto digital converter that is configured to obtain a first plurality ofsamples of a first signal conveyed via a coupling of a memory medium ofan information handling system and convert the first plurality ofsamples to the first plurality of digital values, respectively;determine an impedance based at least on the first plurality of digitalvalues; compare the impedance with a baseline impedance of the couplingof the memory medium; determine an inconsistency based at least oncomparing the impedance with the baseline impedance of the coupling ofthe memory medium; and in response to determining the inconsistency,shut down the information handling system.
 16. The embedded controllerof claim 15, wherein the impedance of the coupling of the memory mediumincludes a first reactive impedance; wherein the baseline impedance ofthe coupling of the memory medium includes a second reactive impedance;and wherein, to determine the inconsistency, the embedded controller isfurther configured to determine that the first reactive impedance doesnot match the second reactive impedance.
 17. The embedded controller ofclaim 15, wherein the first plurality of samples includes a plurality ofvoltage samples.
 18. The embedded controller of claim 15, wherein theembedded controller is further configured to establish the baselineimpedance of the coupling of the memory medium.
 19. The embeddedcontroller of claim 15, wherein the embedded controller includes theanalog to digital converter.
 20. The embedded controller of claim 15,wherein the embedded controller is further configured to: in response todetermining the inconsistency, ground the coupling of the memory medium.